ANSYS Maxwell
A low frequency electromagnetic FEA tool for simulating electromechanical and low frequency electromagnetic performance in motors, transformers, sensors, permanent-magnet devices and more
Maxwell Solvers:
- Magnetic Transient with rigid motion
- AC Electromagnetic
- Magnetostatic
- Electrostatic
- DC Conduction
- Electric Transient
- Simplorer(circuit and system simulation)
- Multiphysics Coupling with ANSYS Mechanical and ANSYS CFD
Application Design Interfaces:
- RMxprt–electric machines
- PExprt–inductors and transformers
ANSYS HFSS
The industry leading tool for modeling high frequency electromagnetic fields. It’s the accuracy standard by which all other solvers are measured.
Solve a wide range of applications in RF and microwave design (e.g. antennas) to performing analysis for signal and power integrity in high-speed PCBs and IC packages.
HFSS Solvers:
- Frequency Domain
- Time Domain
- Integral Equations
- Hybrid FEA-Integral Equation
- Multiphysics coupling with ANSYS Mechanical and ANSYS Icepak
ANSYS Icepak
Powerful electronic cooling solutions, utilizing the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies
Features:
- Comprehensive Multiphysics couplings
- Library of commercial fans, heat sinks, blowers, etc.
- Conduction, Convection, Radiated heat transfer modes
- Integrated into Electronics Desktop
- Import of MCAD geometry
- Import of ECAD geometry
- Powerful Python Scripting for Automation
ANSYS SIwave
Specialized design platform for analyzing signal integrity, power integrity, and EMI analyses of IC Packages and full PCBs
Features:
• ECAD import
• Multiphysics Couplings
• IBIS & IBIS-AMI SerDes Analysis
• DDR3/4 Virtual Compliance
• Decoupling Capacitor Optimization
• Impedance Scanning
• Crosstalk Scanning
• SIwave with HFSS regions
ANSYS Q3D Extractor
Enables the extraction of RLCG parameters in a variety of electromagnetic applications (e.g. IGBTs, traces, connectors bus bars and cables)
Widely used in touchscreen and IC packaging applications
Features:
- Fast 3D Extraction of RLCG parameters
- IBIS Package Model Extraction
- Equivalent Circuit Model Creation
- Touch Panels
- Power Electronics
- IGBT’s
