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Electromagnetic, Signal Integrity, Thermal, and
Electro-Mechanical Simulation Solutions

ANSYS Maxwell

A low frequency electromagnetic FEA tool for simulating electromechanical and low frequency electromagnetic performance in motors, transformers, sensors, permanent-magnet devices and more

Maxwell Solvers:

  • Magnetic Transient with rigid motion
  • AC Electromagnetic
  • Magnetostatic
  • Electrostatic
  • DC Conduction
  • Electric Transient
  • Simplorer(circuit and system simulation)
  • Multiphysics Coupling with ANSYS Mechanical and ANSYS CFD

Application Design Interfaces:

  • RMxprt–electric machines
  • PExprt–inductors and transformers
ANSYS Maxwell


The industry leading tool for modeling high frequency electromagnetic fields. It’s the accuracy standard by which all other solvers are measured.

Solve a wide range of applications in RF and microwave design (e.g. antennas) to performing analysis for signal and power integrity in high-speed PCBs and IC packages.

HFSS Solvers:

  • Frequency Domain
  • Time Domain
  • Integral Equations
  • Hybrid FEA-Integral Equation
  • Multiphysics coupling with ANSYS Mechanical and ANSYS Icepak

ANSYS Icepak

Powerful electronic cooling solutions, utilizing the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies


  • Comprehensive Multiphysics couplings
  • Library of commercial fans, heat sinks, blowers, etc.
  • Conduction, Convection, Radiated heat transfer modes
  • Integrated into Electronics Desktop
  • Import of MCAD geometry
  • Import of ECAD geometry
  • Powerful Python Scripting for Automation
ANSYS Icepak


Specialized design platform for analyzing signal integrity, power integrity, and EMI analyses of IC Packages and full PCBs

• ECAD import
• Multiphysics Couplings
• IBIS & IBIS-AMI SerDes Analysis
• DDR3/4 Virtual Compliance
• Decoupling Capacitor Optimization
• Impedance Scanning
• Crosstalk Scanning
• SIwave with HFSS regions

ANSYS Q3D Extractor

Enables the extraction of RLCG parameters in a variety of electromagnetic applications (e.g. IGBTs, traces, connectors bus bars and cables)

Widely used in touchscreen and IC packaging applications


  • Fast 3D Extraction of RLCG parameters
  • IBIS Package Model Extraction
  • Equivalent Circuit Model Creation
  • Touch Panels
  • Power Electronics
  • IGBT’s
ANSYS Q3D Extractor
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